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Now updated to Revision E of the latest IPC-A-610 and J-STD-001 - the IPC Training and details all of the specifications for minimum/maximum solder joint size, including fillet heights and lengths.
DRM-SMT-E also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead-free solder connections. The appropriate specification/paragraph references from both the IPC-A-610E and J-STD-001E are included for each of the acceptance criteria for further verification. In addition, every change from the D to E revision has been notated to make it easy for your inspectors and operators to learn the new requirements. Product Details
Number of Pages: 38