Full Description

Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques.

Product Details

Published: 11/01/1990 Number of Pages: 37File Size: 1 file , 440 KB Product Code(s): SM-784(D)1