Full Description

The purpose of this standard is to identify the classification level of non-hermetic solid state surface mount devices that are sensitive to moisture-induced stress. They can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation. This standard is used to determine what classification level should be used for initial reliability qualification.

Product Details

Published: 04/01/1999 Number of Pages: 20 Part of: IPC M109