Full Description

This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision G contains over 500 new or revised terms, including new terminology for ball grid array and chip scale packaging, via protection, lead free solders, assembly processes, base materials and high speed/high frequency boards. Also includes commonly used industry acronyms and an index of terms by technology types for easy searching.

Product Details

Published: 12/01/2003 Number of Pages: 135File Size: 1 file , 1.4 MB