Full Description

Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision E incorporates requirements for flexible cover materials used as a flexible dielectric protective layer over etched conductors and other conductive features.

Product Details

Published: 12/01/2010 ISBN(s): 1580986803 ANSI: ANSI Approved Number of Pages: 30File Size: 1 file , 1.5 MB