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IPC 2223C

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IPC 2223C Sectional Design Standard for Flexible Printed Boards

standard by Association Connecting Electronics Industries, 11/01/2011

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$52.36

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$119.00

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Full Description

Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision C provides new design guidance and requirements for bends, folds and creases, staggered flexible layer bands, and strain relief fillets. Also included is a new design tutorial providing guidance on material selection, size and shape of flexible circuits and fabrication allowances.

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Published: 11/01/2011File Size: 1 file , 2.9 MB