IPC J-STD-033C Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007) standard by Association Connecting Electronics Industries, 02/01/2012
IPC AJ-820A Assembly & Joining Handbook Handbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/2012
IPC J-STD-005A Requirements for Soldering Pastes standard by Association Connecting Electronics Industries, 02/01/2012
IPC HDBK-001E Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B Handbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/2012
IPC JEDEC-9704A Printed Circuit Assembly Strain Gage Test Guideline standard by Association Connecting Electronics Industries, 02/01/2012
IPC 4554-WAM1 Specification for Immersion Tin Plating for Printed Circuit Boards with Amendment 1 standard by Association Connecting Electronics Industries, 01/01/2012
IPC 4103A Specification for Base Materials for High Speed/High Frequency Applications standard by Association Connecting Electronics Industries, 12/01/2011
IPC 6018B Microwave End Product Board Inspection and Test standard by Association Connecting Electronics Industries, 11/01/2011
IPC 2292 Design Standard for Printed Electronics on Flexible Substrates standard by Association Connecting Electronics Industries, 03/01/2018
IPC J-STD-033D Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices standard by Association Connecting Electronics Industries, 03/01/2018
IPC 6903A Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry) standard by Association Connecting Electronics Industries, 01/01/2018
IPC 7094A Design and Assembly Process Implementation for Flip Chip and Die-Size Components standard by Association Connecting Electronics Industries, 01/01/2018