IPC A-38 Fine Line Round Robin Test Pattern standard by Association Connecting Electronics Industries, 09/01/1984
IPC D-322 (R1991) Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes Handbook / Manual / Guide by Association Connecting Electronics Industries, 09/01/1984
IPC D-422 Design Guide for Press Fit Rigid Printed Board Backplanes Handbook / Manual / Guide by Association Connecting Electronics Industries, 09/01/1982
IPC TR-481 Results of Multilayer Test Program Round Robin standard by Association Connecting Electronics Industries, 04/01/1981
IPC M-106 Technology Reference for Design Manual Handbook / Manual / Guide by Association Connecting Electronics Industries,
IPC 7351 Generic Requirements for Surface Mount Land Pattern and Design Standard - INCLUDES LAND PATTERN VIEWER SOFTWARE standard by Association Connecting Electronics Industries,
IPC 6013C Qualification and Performance Specification for Flexible Printed Boards standard by Association Connecting Electronics Industries,
IPC DRM-SMT-E Surface Mount Solder Joint Evaluation - Desk Reference Manual Handbook / Manual / Guide by Association Connecting Electronics Industries,
IPC 9691A User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) standard by Association Connecting Electronics Industries,
IPC TA-720 Technology Assessment Handbook on Laminates standard by Association Connecting Electronics Industries,
IPC A-42-G Double Sided Artwork - Gerber Format standard by Association Connecting Electronics Industries,
IPC A-43 Ten-Layer Multi Artwork - D-350 Format standard by Association Connecting Electronics Industries,