IPC DW-424 General Specification for Encapsulated Discrete Wire Interconnection Boards standard by Association Connecting Electronics Industries, 01/01/1995
IPC D-355 Printed Board Automated Assembly Description in Digital Form standard by Association Connecting Electronics Industries, 01/01/1995
IPC CA-821 General Requirements for Thermally Conductive Adhesives standard by Association Connecting Electronics Industries, 01/01/1995
IPC J-STD-001B [ Withdrawn ] Requirements for Soldered Electrical and Electronic Assemblies standard by Association Connecting Electronics Industries, 01/01/1995
IPC TR-582 Cleaning and Cleanliness Testing Program for: Phase - Low Solids Fluxes and Pastes Processed in Ambient Air standard by Association Connecting Electronics Industries, 11/01/1994
IPC TR-581 IPC Phase 3 Controlled Atmosphere Soldering Study standard by Association Connecting Electronics Industries, 08/01/1994
IPC DR-570A General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards standard by Association Connecting Electronics Industries, 04/01/1994
IPC ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards standard by Association Connecting Electronics Industries, 07/01/1994
IPC CI-408 Solderless Surface Mount Connectors Design Characteristics and Application Guidelines Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1994
Composite Metallic Material Specification for Printed Wiring Boards Book by Association Connecting Electronics Industries, 01/01/1994
IPC MS-810 Guidelines for High Volume Microsection standard by Association Connecting Electronics Industries, 10/01/1993
IPC OI-645 Standard for Visual Optical Inspection Aids standard by Association Connecting Electronics Industries, 10/01/1993