IPC 9703 Mechanical Shock Test Guidelines for Solder Joint Reliability standard by Association Connecting Electronics Industries, 03/01/2009
IPC WP-009 A Summary of Tin Whisker Research References standard by Association Connecting Electronics Industries, 03/01/2009
IPC 7094 Design and Assembly Process Implementation for Flip Chip and Die Size Components standard by Association Connecting Electronics Industries, 02/01/2009
IPC 2141A Design Guide for High-Speed Controlled Impedance Circuit Boards standard by Association Connecting Electronics Industries, 03/01/2004
IPC 7912A End-Item DPMO for Printed standard by Association Connecting Electronics Industries, 01/01/2004
IPC D-326A Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies standard by Association Connecting Electronics Industries, 01/01/2004
IPC CM-770E Component Mounting Guidelines for Printed Boards Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/2004
IPC J-STD-001C S-Addendum Space Applications Electronic Hardware Addendum to Requirements for Soldered Electrical and Electronic Assemblies Amendment by Association Connecting Electronics Industries, 01/01/2004
IPC T-50G Terms and Definitions for Interconnecting and Packaging Electronic Circuits standard by Association Connecting Electronics Industries, 12/01/2003
IPC 2251 Design Guide for the Packaging of High Speed Electronic Circuits Handbook / Manual / Guide by Association Connecting Electronics Industries, 11/01/2003
IPC 4411A Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement standard by Association Connecting Electronics Industries, 11/01/2003
IPC 7711/21A Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assemblies standard by Association Connecting Electronics Industries, 10/01/2003